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1. Identificação
Tipo de ReferênciaArtigo em Revista Científica (Journal Article)
Sitemarte3.sid.inpe.br
Código do Detentorisadg {BR SPINPE} ibi 8JMKD3MGPCW/3DT298S
Identificador6qtX3pFwXQZ3r59YCT/H3LsU
Repositóriosid.inpe.br/iris@1905/2005/08.04.03.18   (acesso restrito)
Última Atualização2006:01.26.15.29.00 (UTC) administrator
Repositório de Metadadossid.inpe.br/iris@1905/2005/08.04.03.18.44
Última Atualização dos Metadados2018:06.06.03.55.45 (UTC) administrator
Chave SecundáriaINPE-13388-PRE/8603
ISSN0257-8972
Rótulo10542
Chave de CitaçãoUedaLepRanCruDia:2002:NaCoAn
TítuloNanohardness and contact angle of Si wafers implanted with N and C and Al alloy with N by plasma ion implantation
Ano2002
Data Secundária20020612
MêsJuly
Data de Acesso03 maio 2024
Tipo SecundárioPRE PI
Número de Arquivos1
Tamanho100 KiB
2. Contextualização
Autor1 Ueda, Mario
2 Lepienski, C. M.
3 Rangel, E. C.
4 Cruz, NC
5 Dias, F. G.
Grupo1 LAP-INPE-MCT-BR
Afiliação1 Instituto Nacional de Pesquisas Espaciais (INPE). Laboratório de Física de Plasma (LAP)
RevistaSurface and Coatings Technology
Volume156
Número1-3
Páginas190-194
Histórico (UTC)2005-08-04 03:18:44 :: administrator -> jefferson ::
2006-01-26 15:33:07 :: jefferson -> administrator ::
2018-06-06 03:55:45 :: administrator -> marciana :: 2002
3. Conteúdo e estrutura
É a matriz ou uma cópia?é a matriz
Estágio do Conteúdoconcluido
Transferível1
Tipo do ConteúdoExternal Contribution
Palavras-ChaveFISICA DE PLASMA
Plasma immersion ion implantation
Surface analysis
Nanohardness
Contact angle
Silicon carbide
Silicon nitride
ResumoSurfaces of silicon wafers implanted with N and C, respectively, and aluminum 5052 implanted with N alone by plasma immersion ion implantation WHO were probed by a nanoindentor and analyzed by the contact-angle method to provide information on surface nanohardness and wettability. Silicon nitride and silicon carbide are important ceramic materials for microelectronics, especially for high-temperature applications. These compounds can be synthesized by high-dose ion implantation. The nanohardness of a silicon sample implanted with 12-keV nitrogen PIII (with 3 X 10(17)cm(-2)dose)increased by 10 percent compared to the unimplanted sample, in layers deeper than the regions where the formation of the Si,N, compound occurred. A factor of 2.5 increase in hardness was obtained for C-implanted Si wafer at 35 keV (with 6 X 10(17)cm(-2)dose), again deeper than the SiC-rich layer, Both compounds are in the amorphous state and their hardness is much lower than that of the crystalline compounds, which require an annealing process after ion implantation. In the same targets, the contact angle increased by 65 pecent and 35 percent for N- and C-implanted samples, respectively. Compared to the Si target, the nitrogen PIII-irradiated Al 5052 (wish 15 keV)showed negligible change in its hydrophobic character after ion implantation. Its near-surface nanohardness measurement showed a slight increase for doses of 1 X 10(17)cm(-2). We have been searching for an AlN layer of the order of 1000 A thick, using such a low-energy PIII process, but oxide formation during processing has precluded its synthesis for N- and C-implanted samples, respectively. Compared to the Si target, the nitrogen PIII-irradiated Al 5052 (wish 15 keV)showed negligible change in its hydrophobic character after ion implantation. Its near-surface nanohardness measurement showed a slight increase for doses of 1 X 10(17)cm(-2). We have been searching for an AlN layer of the order of 1000 A thick, using such a low-energy PIII process, but oxide formation during processing has precluded its synthesis.
ÁreaFISPLASMA
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4. Condições de acesso e uso
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Arquivo Alvoueda.pdf
Grupo de Usuáriosadministrator
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Visibilidadeshown
Detentor da CópiaSID/SCD
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Permissão de Leituradeny from all and allow from 150.163
5. Fontes relacionadas
Unidades Imediatamente Superiores8JMKD3MGPCW/3ET2RFS
DivulgaçãoWEBSCI; PORTALCAPES.
Acervo Hospedeirosid.inpe.br/banon/2001/04.03.15.36
6. Notas
Campos Vaziosalternatejournal archivist callnumber copyright creatorhistory descriptionlevel documentstage doi e-mailaddress electronicmailaddress format isbn lineage mark mirrorrepository nextedition notes orcid parameterlist parentrepositories previousedition previouslowerunit progress project readergroup resumeid rightsholder schedulinginformation secondarymark session shorttitle sponsor subject tertiarymark tertiarytype typeofwork url versiontype
7. Controle da descrição
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